Our IC Capability Circuitry
DFT to Analog, we chip into all with dedication
Design Verification
Silicon success thanks to design
Design Verification (DV) clicks when the right methodology is complemented by the right team. First tie silicon success isn’t easy but that’s what our DV engineers bring to you. Extensive knowledge, experience enables them to comprehend the tasks and execute flawlessly. Kick-starting with feature extraction, properties DV project ends with sign-off checklist covering functional aspects, codes, performance, and power. System modeling is leveraged in HW/SW co-verification with our verification architects expertly handling optimal trade-offs.
Design For Test And Debug
Engineering chip anatomy with testability and debugging
Design For Testing (DFT) and Debugging (DFD) are critical stages in the micro-architectural phase of the design. Working in tandem with client’s design team, our experts understand the anatomy of the chip and thus helps carve out its DFT and DFD architecture. They leverage the implemented DFT architecture incorporating RTL and design verification via the pattern generation phase.
Physical Design
Motivated team, better design capability
Rich and extensive Physical Design (PD) experience has enabled the team to work on multiple successful tape-outs. Fully versed in Industry standard EDA tools and well trained to handle low power, high performance and area critical designs, the VLSI Physical Design team at Tessolve leads the design excellence.
FPGA Emulation and Post SI Validation
Prototyping across multi platforms – we make it possible
A full-service spectrum covering FPGA Design, FPGA Prototyping and Emulation Flows. Pre-Silicon Validation, SW development is done leveraging FPGA Prototyping platforms. Emulations, on the other hand, is used for HW/SW verification and full system validation.
Analog & Mixed Signal (AMS) Design
Agile and high quality – analog design creation
Analog and Mixed signal design team at Tessolve specializes in High quality design for different applications with process nodes varying from 350nm to most advanced 7nm designs. The IPs were developed for different industry verticals like Automotive, Communication, Consumer, Medical, IoT etc. The competent team has rich experience of successfully delivering more than 50+ silicon proven analog chips during last few years with full ownership of the delivery from Spec to GDSII sign off, supported with silicon validation to global semiconductor companies.